ABLESTIK ICP9000
Harmonization Code : 3909.20.00.90 | Amino-resins, phenolic resins and polyurethanes, in primary forms : Melamine resins : Other
Main features
- Semi-Sintering Power Die Attach
- Extended 16-Hour Work Life
- Thermal and Electrical Attach Path
Product Description
LOCTITE ABLESTIK ICP 9000 is a one-part, silver-filled semi-sintering die-attach paste for high-power and high-temperature electronic devices. The electrically conductive material has a 16-hour work life and 2-hour open time at 25 deg C and uses a recommended conventional-oven cure of 1 hour at 200 deg C. The cured attach material has a typical thermal conductivity of 100 W/(m K) and volume resistivity of 7 x 10^-6 ohm cm. Guideline bondline thickness is 10 to 25 um for die up to 3 x 3 mm^2 and 20 to 50 um for larger die.
Key features
- Semi-sintering silver attach: Forms an electrically conductive die-attach layer for power semiconductor assembly and solder-replacement evaluation.
- Extended die-placement window: A 16-hour work life and 2-hour open time at 25 deg C provide a defined placement window.
- Thermal and electrical conduction: The cured layer combines 100 W/(m K) thermal conductivity with 7 x 10^-6 ohm cm volume resistivity.
Applications
Applications include die attach for power IC, SiC, GaAs, and GaN devices and Sn/Pb or Au/Sn solder-replacement evaluation within the recommended process.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Values apply to the one-part semi-sintering paste; die-size-specific ramp profiles and bondline guidance remain process-dependent.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Silver liquid | As supplied | |
| Filler type | Silver | As supplied | |
| Thixotropic index | 5.5 | 0.5/5 rpm | |
| Viscosity | 11,500 | mPa s | Brookfield CP51; 25 deg C; 5 rpm |
| Work life | 16 | hours | 25 deg C |
| Open time | 2 | hours | 25 deg C |
| Shelf life | 365 | days | -40 deg C; from date of manufacture |
| Conventional-oven cure | 1 | hour | 200 deg C; guideline recommendation |
After-processing / final-state properties
Bulk properties and package-level results apply only to the stated cured material and test configurations.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass transition temperature | 25 | deg C | Typical cured material |
| Coefficient of thermal expansion, below Tg | 25 | ppm/deg C | TMA |
| Coefficient of thermal expansion, above Tg | 103 | ppm/deg C | TMA |
| Thermal conductivity | 100 | W/(m K) | Typical cured material |
| Volume resistivity | 7 x 10^-6 | ohm cm | Typical cured material |
| In-package thermal resistance | 0.45 | K/W | 7 x 7 mm^2 QFN with 2.5 x 2.5 mm^2 Au BSM die; Ag or PPF substrate |
| Die shear strength | Ag 10.9; Cu 10.8; PPF 10.0 | kg-f | 3 x 3 mm die; tested at 260 deg C |
